• GB/T 19247.6-2024 Page 6
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GB/T 19247.6-2024 Chinese PDF (GB/T19247.6-2024)

GB/T 19247.6-2024 Chinese PDF (GB/T19247.6-2024)

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GB/T 19247.6-2024_Chinese: Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Chinese: 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法)
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English versions: GB/T 19247.6-2024
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