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GB/T 43315-2023_Chinese: Test method for flow pattern defects in silicon wafer - Etching technique (Chinese: 硅片流动图形缺陷的检测 腐蚀法) Note/Careful: Text of PDF is in Chinese (not English). Delivery (PDF in Chinese): 2 working-hours typically, ASAP English versions: GB/T 43315-2023
